Double Side Polished Silicon Wafers

Double Side Polished Silicon Wafers
Product Details

Product Description:

Silicon wafers are an important raw material for making transistors and integrated circuits. Various semiconductor devices can be fabricated by photolithography of a silicon wafer or the like. Chips made of silicon have amazing computing power, and this double side polished silicon wafer is definitely the best choice to meet the market's requirements for lower cost and higher productivity.

Features:

  • Using of the international top wire saw cutting equipment

  • Cutting line speed and pressure under precise control

  • No damage on the surface, such as fine cracks, wire saw marks, surface defects, etc.

  • High quality wire sawing process

Product Details:

Type/dopant

P(B)/N(P)

Dimension156*156mm

Growth Method

FZ/CZ

Orientation

<111><100>

Diameter

4''

Thickness

customized

Resistivity

0.001-10000ohm.cm

Tolerance

±0.01mm

Grade

Prime grade/test grade

Surface

Polishing/Lapping/Grinding

Particle count

@0.03um<100 count

Dislocation Density

No

TTV

<10μm

BOW

≤35μm

Warp

≤30μm

Package

Clean Room, vacuum package

Application:

  • PVD/CVD coating substrate

  • X ray diffraction analysis, scanning electron microscope, atomic force microscope and other analytical test substrates

  • Synchrotron radiation experimental sample carrier

  • Molecular beam epitaxial growing

  • Semiconductor lithography process, etc.

Feedback